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Compact Modeling and Analysis of Through-Si-Via-Induced Electrical Noise Coupling in Three-Dimensional ICs
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
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Analytical and Numerical Model Confrontation for Transfer Impedance Extraction in Three-Dimensional Radio Frequency Circuits
Analog-Digital Co-existence in 3D-IC Gilad Yahalom
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M by Flechet Moda mujer · El Corte Inglés (7)
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3D Integration | SpringerLink
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63rd ECTC Final Program by ECTC - Issuu
